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Thermal Engineering Associates Lowers the Cost of Thermal Testing

2013-04-16 06:00:00| Industrial Newsroom - All News for Today

More New Thermal Interface Material Characterization Tools<br /> <br /> SANTA CLARA, Calif., -- Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm square mounted on a variety of popular packages including BGA, QFN, and DIP.  This range ...This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Thermal Analysis Testers

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