With SMT terminals that provide contact density capable of speeds to 25 Gbps, 1.0 mm pitch MicroSpeed™ high-speed connector system comes in 3-row version. Open pin-field design, which allows for third (center) row to be selectively assigned as ground to optimize signal quality between higher speed signal conductors or rows, can accommodate differential or single-ended signals while maintaining max performance speed. Current-carrying capacity is 1.0 A for signal contacts and 10 A for shielding.