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Toshiba Develops World's First 256Gb, 48-Layer BiCS FLASH

2015-08-04 06:56:07| wirelessdesignonline News Articles

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory.

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