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Wafer Bonding Systems support wafers up to 200 mm in diameter.

2015-03-24 13:31:07| Industrial Newsroom - All News for Today

Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment.

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