Home Wafer Bonding Systems support wafers up to 200 mm in diameter.
 

Keywords :   


Wafer Bonding Systems support wafers up to 200 mm in diameter.

2015-03-24 13:31:07| Industrial Newsroom - All News for Today

Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment.

Tags: support systems diameter bonding

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
26.11JELEEBOX
26.11
26.11222CB
26.11BOSS ( ) BB-1X Bass Driver
26.1112010 re0827-141
26.11
26.11 2021 EDITION
26.11DVD
More »