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Home › eASIC Reduces Multi-Level Package Design Times with CST Microwave Studio

 

eASIC Reduces Multi-Level Package Design Times with CST Microwave Studio

2014-01-23 12:33:50| rfglobalnet Home Page

This case study explains how CST MICROWAVE STUDIO electromagnetic simulation software helped predict the behavior of an eASIC integrated circuit and its package and PCB layout in the design phase.

Tags: times design studio package

Category:Telecommunications

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