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OpenVPX Backplanes come in 3U and 6U configurations.

2016-02-22 14:31:07| Industrial Newsroom - All News for Today

Compliant to VITA 65 specification, standard profile configurations for OpenVPX backplanes include 5-, 9-, and 18-slot 3U versions as well as 2- and 5-slot 6U versions. Each is available with or without rear I/O connectors and designed to cable over to Pixus power boards for VITA 62 or PICMG 2.11 power supplies. Header options are available for VITA 46.11 for system management.

Tags: configurations backplanes openvpx

 

Rugged 3U SBC meets OpenVPX specifications.

2016-01-26 14:31:06| Industrial Newsroom - All News for Today

Based on 5th generation 2.6 GHz Intel Core i7 processor with integrated HD 5600 graphics, Model C874 withstands extremes of temperature, shock, and vibration. Unit is equipped with up to 16 GB of DDR3L SDRAM, complete with ECC. Up to 544 GB of SATA Flash disk memory is available in single level cell, multi-level cell, or combinations of both. I/O options include USB 2.0, SATA II, 1000Base-T+100Base-BX/KX GbE, and discrete I/O lines and serial ports.

Tags: specifications meets rugged sbc

 
 

Rugged 6U OpenVPX Multiprocessor meets high performance needs.

2016-01-22 14:31:06| Industrial Newsroom - All News for Today

While optimized for SWaP-sensitive applications, DSP282 delivers up to 665.6 GigaFLOPS of throughput per card slot to meet needs of processor-intensive systems deployed in harsh environments. Solution supports advanced 3D graphics and features dual 5th generation 2.4 GHz Intel® Core™ i7 quad core processors. RDMA-enabled InfiniBand® and Ethernet dual network interface cards foster scalability, and on-board Security Hub and full support for Intel platform security features are standard.

Tags: high needs performance high performance

 

OpenVPX DSP Modules leverage Intel Xeon D-1500 CPUs.

2015-11-12 14:31:04| Industrial Newsroom - All News for Today

Available with 8-core versions of Intel® Xeon® D-1500 CPUs and supporting forthcoming 12- and 16-core versions, 3U CHAMP-XD1 and 6U CHAMP-XD2 are designed for compute-intensive EW/C4ISR aerospace and defense applications. Rugged open architecture modules offer XMC card expansion and feature DDR4 memory and PCIe Gen 3 data paths on both data and expansion planes. While XD1 module supports combination of 1 Gigabit and 10 Gigabit Ethernet (GbE) interfaces, XD2 adds support for 40 GbE.

Tags: modules intel dsp leverage

 

Modular 4U Chassis supports OpenVPX applications.

2015-10-12 14:31:06| Industrial Newsroom - All News for Today

Available with various options to adapt to application, VPX4V180 Series includes base chassis that is suited for 3–18 medium powered OpenVPX boards. For higher power applications, larger bottom-to-top cooling fans can be used as well as air baffles. For front-to-rear cooling, 5U chassis is available. VPX4V180 Series includes EMC options with integrated components and supplemental gasketing. Integrated fan controller and PSUs designed to VITA 62 are also standard options.

Tags: applications supports modular chassis

 

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