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Tag: lithography
Leading OSAT And FPD Manufacturers Order JetStep Lithography Systems From Rudolph
2015-12-11 02:14:16| metrologyworld Home Page
Rudolph Technologies, Inc. announced recentlythat a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStepW Series Lithography system, which it will use for both fan-out and fan-in packaging approaches
Tags: order
systems
leading
manufacturers
Rudolph Receives Lithography Orders
2015-12-09 01:08:05| Semiconductors - Topix.net
Rudolph Technologies Inc. has received two orders for lithography systems: one from a repeat customer in the semiconductor industry, the other from a flat panel display manufacturer in China. Rudolph said a major outsourced assembly and test facility, with which it has done business before, ordered a JetStep W system.
Tags: orders
receives
rudolph
lithography
Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph
2015-12-08 11:31:12| Industrial Newsroom - All News for Today
Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New Jersey - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep W Series Lithography system, which it will use...
Tags: order
systems
leading
manufacturers
High-Speed/-Resolution Chipset enhances 3D printing, lithography.
2015-10-12 14:31:07| Industrial Newsroom - All News for Today
Accelerating total exposure, chipset consisting of DLP9000X digital micromirror device and DLPC910 controller delivers streaming pixel speed of >60 Gbps. Being equipped with >4 million micromirrors reduces print head requirements while supporting print feature sizes <1 µm, and pixel loading speed enables real-time, continuous, high bit-depth patterns for detailed images with high-resolution features. Other features include random row micromirror loading and 400–700 nm wavelength optimization.
Tags: printing
enhances
chipset
lithography
Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
2015-07-14 12:31:14| Industrial Newsroom - All News for Today
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...
Tags: order
system
level
applications