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Common Starting Point For Phased Array Programs May Save Billions, Years Off Development

2013-03-01 05:11:12| rfglobalnet News Articles

Phased radio frequency (RF) arrays use numerous small antennas to steer RF beams without mechanical movement (think radar without a spinning dish). These electronics are invaluable for critical DoD applications such as radar, communications and electronic warfare.

Tags: years off save point

 

AWR Sponsors And Exhibits At EDICON 2013; Presents A Wide Array Of Technical Papers And Workshops

2013-02-27 06:11:03| rfglobalnet News Articles

AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China.

Tags: and technical wide papers

 
 

Laser Beam Profiling Camera has large array, GigE interface.

2013-02-13 14:34:04| Industrial Newsroom - All News for Today

With 320 x 320 pixel pyroelectric array that can profile beams up to 25 mm without reduction optics, Pyrocam IV measures pulsed and CW (continuous wave) lasers from 13–355 nm and 1.06 to greater than 3,000 µm. Electronics control design includes interface to GigE (Gigabit Ethernet) cameras, and integral focal plane chopper is included for CW beams and thermal imaging. Other features include 14-bit ADC, SNR of 1,000:1, and Ultracal® baseline algorithm. This story is related to the following:Optics and PhotonicsBeam Profilers |

Tags: large camera interface laser

 

Conformal Antenna Array Design on a Missile Platform

2013-02-11 11:23:17| rfglobalnet Downloads

Applications ranging from communications to RADAR and even medical devices depend on antenna arrays. Hand calculations successfully facilitate the construction of stand-alone arrays; however, what happens when the mounting platform becomes a part of the radiating system?

Tags: design platform array antenna

 

TVS Diode Array provides ESD protection for sensitive chipsets.

2013-02-08 14:31:14| Industrial Newsroom - All News for Today

Optimized for protecting chipsets on high-speed data lines such as USB 3.0 and HDMI, SP3012-06UTG safely absorbs repetitive ESD strikes above maximum level specified in IEC61000-4-2 international standard (Level 4) without performance degradation. Dynamic resistance of just 0.4 Ω lowers clamping voltage for reliable chipset performance in field. Supplied in 3.5 x 1.35 x 0.5 mm µDFN-14 package, product offers 0.5 pF capacitance and lets PCB traces to run directly underneath device. This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Diode Arrays

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