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Pulsic's Animate Adopted By Ricoh Electronic Devices For Power Management IC Layout
2015-04-24 04:01:05| electronicsweb Home Page
In 2013, Ricoh Electronic Devices Co., Ltd. organized their layout project teams to reduce integrated circuit (IC) layout design time, targeting a 50% reduction in the entire analog design flow by 2015
Tags: power
management
electronic
devices
BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.
2014-12-04 14:30:49| Industrial Newsroom - All News for Today
Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target PCBs and preventing failures that occur with CTE mismatch.
Tags: accepts
adapter
ic
pitch
KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies
2014-07-07 06:00:00| Industrial Newsroom - All News for Today
Systems Offer Comprehensive Defect Information for Solving Yield Challenges<br /> <br /> SAN FRANCISCO -- Today at SEMICON West, KLA-Tencor Corporation (NASDAQ: KLAC) announced four new systems--the 2920 Series, Puma(TM) 9850, Surfscan® SP5 and eDR(TM)-7110--that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 ...This story is related to the following:Test and Measuring Instruments Sponsored by: Red Lion Controls - UntitledSearch for suppliers of: Inspection Devices |
Tags: review
leading
technologies
portfolio
Mobile PCs and Smartphones Will Be Top Revenue Opportunities for IC...
2014-01-27 16:22:39| Wireless - Topix.net
January 27, 2014 -- Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years, according to a new report from IHS Technology .
Tags: for
top
mobile
opportunities
Xilinx and TSMC Reach Volume Production on all 28nm CoWoS(TM)-Based All Programmable 3D IC ...
2013-10-21 06:00:00| Industrial Newsroom - All News for Today
Proven CoWoS™ technology to scale with Xilinx's 20SoC and 16FinFET 3D ICs<br /> <br /> SAN JOSE, Calif. and HSINCHU, Oct - Xilinx Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) today announced production release of the Virtex®-7 HT family, the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that ...This story is related to the following:Gate Arrays |
Tags: volume
production
reach
ic