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EnSilica and Kili Technology Collaboration Delivers FIPS-Compliant Secure Processor IC
2013-10-08 06:00:00| Industrial Newsroom - All News for Today
Wokingham, UK and Toronto, Canada — EnSilica, a leading independent provider of IC design services, system solutions and IP, has announced that it has successfully collaborated with Kili Technology Corporation of Canada on the development of the Kili 3.1 FIPS 140-2 Level 3 (Federal Information Processing Standard) compliant secure processor IC. The Kili 3.1 secure processor IC is designed to meet the stringent requirements of payment, authentication and identity applications and ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Search for suppliers of: Integrated Circuits (IC)
Tags: technology
secure
collaboration
ic
Xilinx Wins 2013 3D InCites Award for World's First Heterogeneous All Programmable 3D IC
2013-07-23 06:00:00| Industrial Newsroom - All News for Today
Virtex-7 H580T FPGA recognized for its revolutionary contribution to the 3D IC industry<br /> <br /> SAN JOSE, Calif. – Xilinx, Inc. (NASDAQ: XLNX) today announced that its Virtex®-7 H580T FPGA, the world's first heterogeneous All Programmable 3D IC, won the "3D Products (Design/Process)" category in this year's 3D InCites Awards, which recognize the companies that are revolutionizing the 3D IC industry and which were presented last week by 3D InCites and TechSearch International during ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!ServicesSearch for suppliers of: Gate Arrays | Electronic Circuits | Circuits |
Dow Corning and imec to Develop Technologies for 3-D IC Semiconductor Packaging
2013-07-10 06:00:00| Chemical Processing
Dow Corning said July 8 it has joined nano-electronics research center imec to develop 3-D integrated circuit (IC) packaging technologies.
Tags: develop
technologies
packaging
ic
Broadcom and ST tie for top spot in Set-top Box IC market
2013-04-25 18:30:29| Digital TV News
Broadcom (NASDAQ: BRCM) and STMicroelectronics (NYSE: STM) tied in unit shipments for the worldwide set-top box IC Market in 2012, with both delivering between 85 and 86 million video SoCs for set-top boxes, according to ABI Research.
BGA Socket Adapter supports Linear's power supply IC.
2013-01-23 14:30:24| Industrial Newsroom - All News for Today
Accommodating 141-pin, 1.27 mm pitch LTM4609 buck-boost power supply IC's, Giga-snaP™ BGA Socket Adapter pair consists of SF-BGA141A-B-32F female BGA socket with machined pins epoxy overmolded into assembly that matches male pin LS-BGA141A-31 BGA adapter. RoHS compliant BGA socket is soldered to PCB using standard soldering methods without warping. Both socket and adapter are constructed with high-temperature FR-4 body, preventing failures that occur due to CTE mismatch. This story is related to the following:Socket Adapters
Tags: power
supply
supports
adapter