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IC Packaging Design/Analysis Solution offers all necessary tools.

2016-03-21 13:31:04| Industrial Newsroom - All News for Today

Focused on advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, IC packaging design and analysis solution includes Cadence® OrbitIO™ Interconnect Designer, Cadence System-in-Package (SiP) Layout, and Cadence Physical Verification System (PVS). Capabilities enable multi-substrate interconnect pathway design, refinement, implementation and manufacturing verification and signoff spanning die I/O pad rings through IC package to system PCB.

Tags: tools offers necessary solution

 

ClubStak high-strength Cartons Offer Snack Foods Performance-oriented Alternative to Corrugated for Warehouse Club, Mass Market Retail Packaging

2016-03-21 11:31:09| Industrial Newsroom - All News for Today

Bala Cynwyd, Pa.  - With an ever-expanding definition of what constitutes a snack food item, it is becoming increasingly important for brand owners to rethink their packaging approach. In fact, a recent Associated Press article made the bold statement that there are no meals anymore, only snacks. To help snack...

Tags: offer club market alternative

 
 

Samsung Introduces Full Line-Up Of LED Components Based On Chip-Scale Packaging Technology

2016-03-18 07:20:20| surfacefinishing News Articles

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, recently introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages

Tags: full based technology led

 

ProAmpac Wins Two Flexible Packaging Association Awards

2016-03-16 11:31:10| Industrial Newsroom - All News for Today

Cincinnati, OH ProAmpac, a leading global flexible packaging company, announces recognition from the Flexible Packaging Association for two Silver awards in Packaging Excellence for Dukes Mayonnaise 8oz. Pouch and White Lily Flour Box Pouch. Dukes Mayonnaise 8oz. Pouch is a shaped, spouted stand up pouch, a...

Tags: association awards flexible packaging

 

Ashland Launches New Matte Coating for Flexible Packaging

2016-03-16 06:00:00| Coatings World Breaking News

Tags: flexible packaging launches coating

 

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