Home › IC Packaging Design/Analysis Solution offers all necessary tools.
 

Keywords :   


IC Packaging Design/Analysis Solution offers all necessary tools.

2016-03-21 13:31:04| Industrial Newsroom - All News for Today

Focused on advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, IC packaging design and analysis solution includes Cadence® OrbitIO™ Interconnect Designer, Cadence System-in-Package (SiP) Layout, and Cadence Physical Verification System (PVS). Capabilities enable multi-substrate interconnect pathway design, refinement, implementation and manufacturing verification and signoff spanning die I/O pad rings through IC package to system PCB.

Tags: tools offers necessary solution

Category:Industrial Goods and Services

Latest from this category

All news
17.05Next MANAchat Series Scheduled for the Week of June 10
15.05Relationship Reviews Strengthening the Partnership Between Manufacturer and Rep
14.05Consolidated Financial Statements for the twelve-month period ended March 31, 2024
14.05Actions to Implement Management that is Conscious of Cost of Capital and Stock Price
Industrial Goods and Services »
21.05Eastern North Pacific Tropical Weather Outlook
21.05Atlantic Tropical Weather Outlook
20.05Dantex USA appoints Rob Tolland VP of sales
20.05MDARD designates two bovine tuberculosis testing areas
20.05USDA moves to electronic identification tags
20.05Better pasture and hay conditions anticipated for 2024
20.05Panasonic offers Fire TV, Google TV and Powered by TiVo
20.05Eutelsat reports results for the period ended 31 March 2024
More »