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COM Express Module employs 6th Gen Intel Core i7/i5/i3 CPUs.

2016-03-11 14:31:06| Industrial Newsroom - All News for Today

Supporting Intel® 6th Generation Core™ i7/i5/i3 SoC processors, MB-73430 offers Type 6 pin-outs, 3 DDI channels and one LVDS channel. This basic-size COM Express module, which also incorporates Intel Gen9 HD Graphics with HEVC (H.265) support up to 32 GB dual-channel DDR4 memory, supports up to 3 independent displays as well as 8 PCIex1 Gen 3. Features enhance productivity in such areas as factory automation and counter- and cart-based medical applications.

Tags: express core module gen

PICMG 1.3 SHB utilizes dual Intel Xeon Processor E5 v3 CPUs.

2016-03-04 14:31:05| Industrial Newsroom - All News for Today

Supporting up to 2 Intel® Xeon® E5-2600 v3 CPUs, ROBO-8122VG2R PICMG 1.3 system host board (SHB) can deliver up to 256 GB DDR4 ECC registered memory and adopts ASPEED AST1400 graphic engine to offer 2D performance via VGA port. Flexible PCIe configuration on backplane provides up to 36 lanes. Applications include medical imaging systems, industrial automation/control systems, digital security surveillance, and broadcasting systems.

Tags: dual v3 intel processor

Embedded SBC (3.5 in.) leverages 6th Gen Intel Core i7/i5/i3 CPUs.

2016-02-18 14:31:06| Industrial Newsroom - All News for Today

Operating over -40 to +85°C with 12–36 V input , fanless EBC-1000 Series supports up to 16 GB of dual channel DDR4 (2,133 MHz) and employs Advanced Intel® HD Graphics 520 graphics engine. Onboard DVI-I, DisplayPort, and dual-channel, 24-bit LVDS display interfaces support up to ultra HD 4K resolution. Along with diverse I/O, connectivity, and storage options, SBC provides onboard SUMIT A, B connection for expansion capabilities.

Tags: core gen intel 6th

Multi-Sectional Fansinks effectively cool CPUs and GPUs.

2016-01-21 14:31:06| Industrial Newsroom - All News for Today

Based on Multiple Flow Entrance Technology™, QuadFLOW™ Fansinks use directed airflow in multiple fin fields, cooling electronic components more effectively than liquid cooling methods. Fin fields are not parallel to each other, but instead are designed to allow airflow to enter from multiple directions. Airflows reach central core, where they are extracted by blower through multiple fin fields. Depending on configuration deployed, cooling performance is near or equal to 0.1°C/W.

Tags: cool effectively cpus gpus