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Tag: interconnect
Industry Leaders To Establish Open Interconnect Consortium To Advance Interoperability For Internet Of Things
2014-07-08 11:23:52| wirelessdesignonline News Articles
Technology industry leaders Atmel Corporation, Broadcom Corporation, Dell, Intel Corporation, Samsung Electronics Co., Ltd., and Wind River, are joining forces to establish a new industry consortium focused on improving interoperability and defining the connectivity requirements for the billions of devices that will make up the Internet of Things (IoT).
Tags: internet
open
things
industry
Break-Over Torque Wrenches work on RF interconnect components.
2014-06-24 14:30:57| Industrial Newsroom - All News for Today
Used to fasten connections between components and systems, 20+ beak-over type torque wrenches are available for multiple RF connector types: 1.0 mm, 2.4 mm, 2.92 mm, 3.5 mm, 7 mm, SC, SMA, SMC, SSMA, SSMC, Type N, and TNC designs. Available hex/bit sizes include 5/16, 5/8, 15/64, 5/32, 1/4, 9/16, 13/16, 3/4, and 25/32 in., and max torque values are preset and range from 2–14 lb-in. Construction features nickel-plated steel wrench head connected to anodized aluminum handle. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Torque Wrenches | Torque Tools
Tags: work
components
torque
interconnect
EDA Software cuts die-package interconnect planning time.
2014-05-30 14:31:06| Industrial Newsroom - All News for Today
Used early in design cycle, Cadence® OrbitIO™ provides rapid planning of interfaces across multiple fabrics. As part of overall co-design solution, Cadence OrbitIO integrates with Cadence SiP Layout and Cadence Encounter® digital implementation platform, allowing design teams to clearly communicate design intent throughout flow. Software can enable fabless semiconductor or systems companies to evaluate package route feasibility, and communicate route plan to package design resources. This story is related to the following:Electronic Design Automation (EDA) Software
Tags: time
software
planning
cuts
SRC And UC Berkeley Pursue More Cost-Effective Approach To 3D Chip Integration Compared To Current 3D Interconnect Solutions
2014-05-09 13:07:59| rfglobalnet News Articles
University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.
Tags: to
current
solutions
approach
interconnect Guy PCI and PCIe made a dramatic impact on the...
2014-04-27 15:47:21| Electronics - Topix.net
PCI and PCIe made a dramatic impact on the electronics industry as a whole, far, far beyond our humble goals in 1990 as we founded the PCI-SIG.
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