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Tag: soldering
Wave Soldering System combines capacity and capability.
2014-06-17 14:32:23| Industrial Newsroom - All News for Today
Optimized for production capability and capacity, Electrovert® Electra™ uses IsoThermal convection pre-heat. Full nitrogen tunnel can be field upgraded, and Intelligent Flux Control is available with Full Tunnel feature. Along with 24 in. process width capability, this wave soldering system features integrated fume extraction, dual head ServoJet™ fluxing and DwellMax™ Plus solder nozzles. This story is related to the following:Wave Soldering Equipment
Tags: system
capacity
wave
capability
Ultrasonic Lead Soldering and Bus Bar Additions for Heaters and EMI Shielding
2014-05-27 06:00:00| Industrial Newsroom - All News for Today
Abrisa Technologies is a vertically integrated manufacturer of heater elements and advanced display cover glass with EMI filtering. Value-add capabilities now include ultrasonic soldering of wire leads to screen printed and thin film deposited bus bars on index-matched indium tin oxide (IMITO) and anti-reflective (AR) coated glass.<br /> <br /> Utilizing ultrasonic soldering makes it possible to apply bus bars and lead wires in a single step, directly to the glass or ITO conductive surface, ...This story is related to the following:Materials and Material ProcessingSoldering Services | Soldering Machinery |
Dip Soldering Systems suit short-run, batch applications.
2014-05-14 14:30:45| Industrial Newsroom - All News for Today
Touchscreen controlled models of Auto-Dip series feature programmable preheat and dip height settings as well as adjustable, finger-type PCB holder that firmly grips edges of board throughout soldering cycle. Accommodating heavy component-laden assemblies and customized pallets of small, irregularly-shaped PCBs, systems offer programmable speed, dip angle, lift angle, and dwell time. Largest model handles PCBs up to 23.6 x 13.8 in. and has 100 Kg, titanium solder pot. This story is related to the following:Soldering & Desoldering Equipment |
Tags: systems
applications
suit
dip
Indium Corporation Expert to Present at International Conference on Soldering and Reliability
2014-05-06 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.<br /> <br /> Briggs’ presentation, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in ...
Tags: international
present
corporation
conference
IPC Hand Soldering Competition Winner Crowned at National Electronics Week 2014
2014-04-22 06:00:00| Industrial Newsroom - All News for Today
At National Electronics Week 2014 in Birmingham, England, 20 competitors showed off their hand soldering skills during IPC hand soldering competition. Andrew Smith, Custom Interconnected Ltd., took first place with score of 167 out of a possible 176. He took home a cash prize of £300 and earned a spot at IPC Hand Soldering WORLD CHAMPIONSHIP. Helen Reynolds of Custom Interconnected Ltd. came in second with score of 157 and Mark Smith of CSM Electronics Ltd. took third place with score of ...This story is related to the following:Trade Associations
Tags: week
hand
national
electronics
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