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Tag: collaboration
FTDI Chip Announces Collaboration with MCCI for Advanced Embedded SoC Products
2014-08-26 06:00:00| Industrial Newsroom - All News for Today
FTDI Chip is pleased to announce that its technology partnership with MCCI® Corporation, a leading developer of USB drivers and firmware for embedded SoC, has resulted in the availability of TrueTask® USB - an embedded USB host stack designed for use with FTDI Chip's ground-breaking FT900 product family.<br /> <br /> TrueTask USB is a high performance, production-ready embedded USB host stack supporting the highly integrated FT900 series of application-focused microcontroller units (MCUs). ...This story is related to the following:Computer Hardware and PeripheralsEmbedded Software |
Tags: advanced
products
collaboration
chip
Star Cruises Chooses BlueCielo Project Portal for Document Control, Change Management and Collaboration in New Building Projects
2014-08-22 12:11:00| Offshore Technology
The BlueCielo solution will streamline document management and control processes; enhance Management of Change (MoC) and support global collaboration between internal and external stakeholders.
Tags: new
change
control
management
Star Cruises Selects BlueCielo Project Portal for Document Control, Change Management and Collaboration in New Building Projects
2014-08-22 12:10:00| Power Technology
The BlueCielo solution will streamline document management and control processes; enhance Management of Change (MoC) and support global collaboration between internal and external stakeholders.
Tags: new
change
control
management
Water And Agriculture Leaders Plant Seeds For Environmental Progress In Rare Collaboration
2014-08-22 11:26:15| pollutiononline Home Page
The US Water Alliance issued a report recently highlighting common ground and innovative strategies between agriculture and water and wastewater utilities to reduce nutrient pollution in the Mississippi River Basin.
Tags: water
progress
environmental
leaders
Rudolph Announces New SONUS Technology And Collaboration With TEL NEXX For Advanced Packaging Process Control
2014-08-07 10:37:33| metrologyworld Home Page
Rudolph Technologies, Inc. announced recently the availability of its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs)
Tags: advanced
tel
control
technology
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