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DHi Implements Core Exchange Program for GE and Suzlon Wind Turbine Generator Pitch Slip Rings
2014-03-18 05:00:00| Industrial Newsroom - All News for Today
DHi® (Defense Holdings, Inc.®) of Manassas Park, VA has established a Core Exchange Program for Pitch Control Slip Rings used in GE1.X and Suzlon S88 WTGs. The program is currently limited to Stemman Slip Rings only, Models 6262151, 6262290, 6262875, or equivalent, serving the North American markets (U.S and Canada). Expansion to other markets will be considered on a case basis. The Program will be jointly administered by DHi and H&N Wind (H&N).<br /> <br /> DHi entered the wind industry with ...This story is related to the following:Slip Rings
Tags: program
exchange
core
wind
SoftBank Said to Ready Broadband Pitch on Merger Resistance
2014-03-10 17:23:05| Telecom - Topix.net
SoftBank Corp. President Masayoshi Son is reframing his argument for consolidation in the U.S. mobile-phone market, heading to Washington this week to advocate for wireless broadband as an alternative to cable.
Tags: ready
resistance
broadband
pitch
SoftBank Said to Ready Broadband Pitch on Merger Resistance
2014-03-10 13:25:39| IT Services - Topix.net
SoftBank Corp. President Masayoshi Son is reframing his argument for consolidation in the U.S. mobile-phone market, heading to Washington this week to advocate for wireless broadband as an alternative to cable.
Tags: ready
resistance
broadband
pitch
SoftBank Said to Ready Broadband Pitch on Merger Resistance
2014-03-10 11:44:36| Wireless - Topix.net
SoftBank Corp. President Masayoshi Son is reframing his argument for consolidation in the U.S. mobile-phone market, heading to Washington this week to advocate for wireless broadband as an alternative to cable.
Tags: ready
resistance
broadband
pitch
BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
2014-02-26 14:30:44| Industrial Newsroom - All News for Today
RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter. Both BGA socket and adapter are constructed with polyimide and FR-4 body. This story is related to the following:Ball Grid Array (BGA) Sockets |
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