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RMI's Next Generation of Precision Cylindrical Lenses: Enhanced Cylindrical Lens Line Includes a Range of Materials from DUV to FIR

2015-08-26 12:31:11| Industrial Newsroom - All News for Today

Lafayette, Colorado By developing a proprietary manufacturing process that includes state-of-the-art equipment and technical know-how, Rocky Mountain Instrument Co. (RMI) has enhanced their custom lens product line with a new generation of custom and standard precision cylindrical lenses. Available in a variety...

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Global Mushroom Materials Market: Industry Analysis and Opportunity...

2015-08-26 11:32:50| Furniture - Topix.net

Mushroom materials are developed from agricultural waste and other suitable materials which are completely biodegradable and free from any volatile organic compound content. These materials are the suitable alternatives for plastic and other synthetic based materials.

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Organoleptic Characteristics of Flavor Materials

2015-08-26 07:00:16| Appliances - Topix.net

Judith Michalski and organoleptic evaluation panelists explore a variety of flavor components and applications, including vanilla oleoresin Bourbon 20X P&N, Parsley seed oil P&N, coffee absolute P&N and more. This is only an excerpt of the full article that appeared in P&F Magazine.

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New Materials From SABIC Can Benefit Base Station Component Designs And Performance

2015-08-25 08:51:11| rfglobalnet News Articles

SABIC has developed new solutions to help manufacturers of base station antennas – in particular, internal components such as phase shifters – meet this demand with a new portfolio of THERMOCOMP compounds that have been engineered to meet specific performance requirements in ways that are superior to two incumbent materials, ceramics and PCBs.

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IPC Releases Amendment to printed board materials specification.

2015-08-24 14:31:07| Industrial Newsroom - All News for Today

As amendment to IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards, IPC-4101D-WAM1 delivers trending information for base materials used for rigid and multilayer printed boards. This revised standard, released by IPC, also covers requirements for laminate or prepreg base materials primarily used for rigid and multilayer printed boards for electrical and electronic circuits. There are also 64 individual, keyword-searchable specification sheets and one new table.

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