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R&D Circuits Acquires Altanova Corporation
2013-10-03 06:00:00| Industrial Newsroom - All News for Today
<p align="left"> <font size="3">South Plainfield, NJ and San Jose, CA</font><br /> <br /> <font size="3">RD Circuits Inc. announced that it has acquired Altanova Corporation, specializing in High Speed Digital, Mixed Signal and RF ATE boards and providing design, simulation, fab, assembly and test for ATE, Characterization Boards and Probe Cards. The company operates out of San Jose, California, with design facilities in Latin America and Asia. The combined company will now operate under ...
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Monsanto to Acquire The Climate Corporation, Combination to Provide Farmers with Broad Suite of Tools Offering Greater On-Farm Insights
2013-10-02 06:00:00| Corn & Soybean Digest
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Indium Corporation Soldering Products Meet New IPC J-STD004B
2013-10-02 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk.<br /> <br /> Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability.<br /> <br /> Users' existing solder products may meet the existing J-STD-004, but could fail to ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdSearch for suppliers of: Soldering Compounds | Soldering Flux | Flux Cored Wire | Printed Circuit Board (PCB) Handling Equipment |
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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...
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corporation
Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...
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present
electronics
corporation
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