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Microwave Journal Interview: Qorvo Set To Double GaN Capacity With 6" Wafers
2015-10-22 13:20:27| rfglobalnet Home Page
This video announces Qorvo's new plan to double their GaN capacity by converting their 4" wafers to 6" wafers, and how they plan to make this transition as successful as possible.
Tags: set
journal
double
capacity
Microwave Journal Interview: Qorvo Set To Double GaN Capacity With 6" Wafers
2015-10-22 13:20:27| wirelessdesignonline Downloads
This video announces Qorvo's new plan to double their GaN capacity by converting their 4" wafers to 6" wafers, and how they plan to make this transition as successful as possible.
Tags: set
journal
double
capacity
Low-cost wafers for solar cells
2015-10-12 21:02:00| Climate Ark Climate Change & Global Warming Newsfeed
ScienceDaily: Silicon wafers are the heart of solar cells. However, manufacturing them is not cheap. Over 50 percent of the pure silicon used is machined into dust. A new manufacturing technique developed by Fraunhofer researchers puts an end to these material losses, with raw material savings of 50 percent along with an 80 percent reduction in energy costs. They sparkle in dark blue on the rooftops. In our homes they give us illumination, while providing lamps, refrigerators and other household appliances with...
Tags: cells
solar
wafers
lowcost
Wafer Bonding Systems support wafers up to 200 mm in diameter.
2015-03-24 13:31:07| Industrial Newsroom - All News for Today
Designed for universities and R&D groups, EVG®580 ComBond® System comes with 1 cassette station or manual load port as well as single-arm robot, supporting up to 3 process modules. EVG580 ComBond HVM, intended for high-volume manufacturing, can be configured with 2 cassette stations or equipment front-end module with up to 4 cassettes for continuous operation. System comes with dual-arm robot to support up to 6 process modules for max throughput. Both operate in high-vacuum-process environment.
Tags: support
systems
diameter
bonding
Fused Silica Wafers measure quality of optical coatings.
2014-07-11 14:30:34| Industrial Newsroom - All News for Today
Exhibiting less than 10 Å surface roughness with surface quality of 40-20, TECHSPEC® Fused Silica Wafers are thin, circular pieces of UV fused silica designed to be used as test substrates to measure quality of optical coatings. Each is ultrasonically cleaned and delivered in contaminant-free packaging. Available in 100, 200, and 300 mm diameters, RoHS-compliant wafers have thickness of 1.00 mm and transmission range of 0.2–2.2 µm. This story is related to the following:Silicon Wafers
Tags: quality
measure
optical
coatings