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Tag: platforms
EDX Wireless And Remcom Integrate Wireless Network Design Platforms
2016-03-29 03:09:13| Wireless - Topix.net
EDX Wireless and Remcom announce the integration of SignalPro with Wireless InSite X3D ray-tracing beginning with the release of SignalPro version 8.3. The X3D model from Remcom uses GPU acceleration to greatly reduce calculation time. The model includes effects from reflections, diffractions, and transmissions and serves a variety of service area environments including urban, indoor and indoor/outdoor.
Tags: design
network
wireless
integrate
EDX Wireless And Remcom Integrate Wireless Network Design Platforms
2016-03-28 18:06:13| rfglobalnet Home Page
EDX Wireless and Remcom have recently announced the integration of SignalPro® with Wireless InSite® X3D ray-tracing with the release of SignalPro version 8.3.
Tags: design
network
wireless
integrate
Digital Alert Systems Announces Major Software Upgrade for DASDEC(TM) Platforms
2016-03-17 11:31:09| Industrial Newsroom - All News for Today
New Alert Agent Simplifies Configuration Management and Enables Unprecedented Level of Control to Handle Any EAS Issue LYNDONVILLE, N.Y. Digital Alert Systems (DAS), a division of Monroe Electronics, will soon release a major software upgrade to the DASDEC platforms for advanced Emergency Alert Systems (EAS...
Tags: software
digital
systems
major
Mexia Interactive-Passenger Analytics and Reporting Platforms
2016-03-17 10:49:00| Airport Technology
MEXIA Interactive is the leading global provider of curb-to-gate passenger analytics and reporting platforms.
Tags: reporting
analytics
platforms
mexia
Semtech to Demonstrate Innovative Wireless Charging and Power Management Platforms at APEC 2016
2016-03-15 17:53:50| Semiconductors - Topix.net
Included in the demonstration will be some of Semtech's most innovative technologies, including the industry's first multi-mode wireless power platform , and its Neo-Iso isolated power switch platform for Internet of Things and smart applications. Semtech's TS80K wireless charging chipset, which was announced in late 2015, supports all major industry standards and offers flexible design and scalable power for easy implementation into next-generation consumer and industrial electronic products, including mobile devices, computers, furniture, vehicles, buildings and more.
Tags: power
management
wireless
innovative
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