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AdvancedMC Module supports wireless processing applications.
2014-01-27 14:31:31| Industrial Newsroom - All News for Today
Featuring processing power of Xilinx Virtex®-7 FPGA and two TI TMS320C6670 multicore DSPs, Model AMC-V7-2C6670 is designed for wireless processing applications, including 4G, LTE, LTE Advanced, and beyond. Device includes up to 2 GB of 64-bit wide DDR3-1600 SDRAM for each DSP, as well as Serial RapidIO, Gigabit Ethernet, and PCI Express for maximum I/O flexibility. Full-size, single width PICMG AMC.0 R2.0 AMC is suitable for use in both ATCA carriers and MicroTCA chassis. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: I/O Modules
Tags: applications
processing
wireless
supports
Computing Module supports processor scalability.
2013-10-16 14:31:42| Industrial Newsroom - All News for Today
Along with Intel® HD graphics unit, conga-QA3 Qseven module features one of 5 Intel Atom™ E3800 series processors from 5 W, 1.46 GHz, single-core to 10 W, 1.91 GHz, quad-core. L2 cache can be shared by multiple cores, and modules support Intel AES-NI set. Accommodating needs of industrial mobile applications in harsh environments, all modules are fitted with ceramic capacitors. Other features include multiple interfaces, 2 GB DDR3L memory, up to 16 GB eMMC 4.5, and dual display support. This story is related to the following:Single Board Computers
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computing
processor
L-Band 90 W GaN Power Module supports surface mounting.
2013-10-03 14:30:23| Industrial Newsroom - All News for Today
Optimized for commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2–1.4 GHz, MAMG-001214-090PSM scales to peak pulse power levels of 100 W in 14 x 24 mm package that supports SMT assembly. Two-stage, fully matched GaN in Plastic power module, under pulsed conditions, delivers output power >90 W with 30 dB typ associated power gain and 58% typ power added efficiency. Product supports 50 V operation and up to 3 ms pulse width/duration. This story is related to the following:Power Modules
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surface
supports
module
COM Express Module supports 4th Gen Intel® Core(TM) processors.
2013-09-05 14:30:34| Industrial Newsroom - All News for Today
Featuring max thermal design power of 15 W, conga-TC87 Type 6 COM Express Module can be equipped with embedded dual-core single-chip processors: Intel Core i7-4650U, i3-i5-4300U, or i3-4010U. Module supports dual-channel DDR3L memory up to 16 GB, as well as Intel® flexible display interface, DirectX 11.1, OpenGL 4, OpenCL 1.2, and flexible hardware decoding. conga-TC87 provides 8 USB ports, 4 PCI Express 2.0 lanes, 4 SATA ports with up to 6 Gbps, RAID support, and Gigabit Ethernet interface. This story is related to the following:Central Processing Unit (CPU) Boards |
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4th
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Type 6 COM Express Module supports 4th Gen Intel Core processors.
2013-09-05 14:30:34| Industrial Newsroom - All News for Today
In addition to quad-core Intel® Core™ i7-4700EQ processor, conga-TS87 supports such variants as Intel® Core™ i3-4100E (TDP 25 W) and Intel Core i5-4100E processor. Features include Intel Advanced Vector Extensions 2.0, variable coder and 4K2K support for large displays, as well as Intel® Advanced Encryption Standard New Instructions set. Supporting dual-channel DDR3L memory up to 16 GB (1,600 MT/s), board leverages Mobile Intel QM87 Express chipset and offers diverse interfaces. This story is related to the following:Computer Boards
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