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COM Express Module supports data-centric applications.

2015-11-12 14:31:04| Industrial Newsroom - All News for Today

Measuring 125 x 95 mm, Model PCOM-B634VG utilizes Intel® Xeon® Processor D-1500 Family, which integrates up to 8 CPU cores, each with three 1.5 MB cache, of up to 12 MB in total. Module provides one PCIe x16 and eight PCIe x1 channels, one standard GbE interface plus two 1/2.5/10 GbE Intel® Ethernet interfaces in C/D pin row. Three SODIMM memory slots support dual-channel DDR3L-1600 or DDR4-2400 configurations with max capacity of 128 GB and ECC support.

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Smart Pump Module supports chilled beam designs.

2015-11-04 14:31:06| Industrial Newsroom - All News for Today

Offering proactive condensation control for active chilled beams, NEUTON™ comes complete with integrated direct digital controller, chilled and hot water connections, valves, variable-speed EC motor pumps, and smart sensors. Plug-and-play module blends and re-circulates return water within its zone to convert typical 42°F and 140°F primary loop water temperatures to optimal 58°F or 100°F chilled beam discharge temperatures, preventing cooling mode condensation and heat stratification.

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SFF SMARC Module supports ARM Cortex A9 i.MX6 processors.

2015-09-03 14:31:07| Industrial Newsroom - All News for Today

Powered by quad core/dual core/dual lite/solo core 1.0 GHz Freescale i.MX6 processor, 82 x 50 mm RM-F600-SMC SMARC (Smart Mobility ARChitecture) module is suited for mobile and HMI systems. Integrated features include image capture interface for MIPI cameras; 18/24-bit parallel LCD, LVDS, and HDMI interface; as well as full-HD, 1080p hardware video codec engine. Further integrated with 1 GB DDR and 4 GB eMMC memory, module supports 10/100/1000 MBit Ethernet, Linux 3.0, and Android 4.3.

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XMC Mezzanine Module supports reconfiguration by user.

2015-06-22 14:31:06| Industrial Newsroom - All News for Today

Able to be reconfigured via direct download into Flash configuration memory over PCIe bus or JTAG port, XMC-7A200 serves as co-processor applying custom logic and algorithms to streams of remote sensor data. Features include Xilinx® Artix®-7 FPGA and 128M x 16-bit Quad DDR3 SDRAM as well as 4-lane high-speed serial interface on rear P15 connector for PCIe Gen 1/2 (standard), Serial RapidI/O, and Xilinx Aurora implementations. Rear I/O and other build options are also available.

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Compact Gigabit Ethernet I/O Module supports diverse input types.

2015-06-02 14:31:06| Industrial Newsroom - All News for Today

Based on PowerDNA® Cube architecture, UEINet™ Series offers data acquisition, control, and I/O platform for applications requiring a compact footprint. Rugged 2.7 x 4.0 x 4.1 in. chassis is rated for operation from -40 to +70°C, withstands 5 g vibration and 100 g shock, and supports range of high- and low-voltage analog and digital signals. For deployment flexibility, module operates with 2 primary subsections: core module and I/O board.

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