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Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2013-02-13 12:26:28| dairynetwork Downloads
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
Tags: series
heat
stick
aluminum
Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series
2013-02-13 12:25:14| electronicsweb Downloads
The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).
Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series
2013-02-13 12:25:14| rfglobalnet Downloads
The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).
Forged Aluminum Heat Sinks with Pin Fins: APR Series
2013-02-13 12:23:47| electronicsweb Downloads
The APR Series of forged heat aluminum heat sinks features omni-directional pins, precision forging technology for high power applications, multiple pin heights, and much more. This series is designed for BGA and other surface mount ICs (integrated circuits).
Forged Aluminum Heat Sinks with Pin Fins: APR Series
2013-02-13 12:23:47| rfglobalnet Downloads
The APR Series of forged heat aluminum heat sinks features omni-directional pins, precision forging technology for high power applications, multiple pin heights, and much more. This series is designed for BGA and other surface mount ICs (integrated circuits).
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