je.st
news
Tag: heat
Forged Aluminum Heat Sinks with Plate Fins: AER Series
2013-02-13 12:22:07| electronicsweb Downloads
The AER Series of forged heat aluminum heat sinks features precision forging technology for high power applications. Multiple fin heights and various mounting methods are available. This series is designed for BGA and other surface mount ICs (integrated circuits).
Tags: series
heat
plate
aluminum
Forged Aluminum Heat Sinks with Plate Fins: AER Series
2013-02-13 12:22:07| rfglobalnet Downloads
The AER Series of forged heat aluminum heat sinks features precision forging technology for high power applications. Multiple fin heights and various mounting methods are available. This series is designed for BGA and other surface mount ICs (integrated circuits).
Tags: series
heat
plate
aluminum
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| electronicsweb Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| rfglobalnet Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| electronicsweb Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
Sites : [256] [257] [258] [259] [260] [261] [262] [263] [264] [265] [266] [267] [268] [269] [270] [271] [272] [273] [274] [275] next »