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Print-Place-Reflow Package performs prescision, high-mix assembly.
2014-01-29 14:28:59| Industrial Newsroom - All News for Today
Occupying minimal floor space, 2500-MV accommodates companies that require short-run, in-house production capability for ultra-precise, high component-mix SMT assembly. Included MC-400 pick and place system features Cognex® on-the-fly and bottom vision alignment for high-accuracy, 2,500 cph placement of SMDs. Additional package components include heavy-duty MC-110 stencil printer, which offers ±0.02 mm (<1 mil) repeatability, and MC-301 profilable batch reflow oven with benchtop design. This story is related to the following:Printing and Duplicating EquipmentThermal and Heating EquipmentWave Soldering Equipment | Surface Mount Technology (SMT) Screen Printers | Reflow Ovens | Stencil Printers
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assembly
performs
FY14-15 Decision Package List
2014-01-23 21:45:23| PortlandOnline
PDF Document, 20kbCategory: Meeting 6
eASIC Reduces Multi-Level Package Design Times with CST Microwave Studio
2014-01-23 12:33:50| rfglobalnet Home Page
This case study explains how CST MICROWAVE STUDIO electromagnetic simulation software helped predict the behavior of an eASIC integrated circuit and its package and PCB layout in the design phase.
Tags: times
design
studio
package
High-Density Power Modules come in 12 x 12 x 2.75 mm package.
2014-01-17 14:32:38| Industrial Newsroom - All News for Today
Multi-output, synchronous step-down, programmable power modules XRP9710 and XRP9711 provide 2 fully integrated regulators with MOSFETs, inductors, and internal input and output capacitors that support loads up to 6 A each. Additionally, XRP9711 offers 2 controller outputs each capable of driving loads up to 30 A. Input range is 5–22 V, and output voltages can be programmed from 0.6–5.5 V without requiring any external components. SMBus-compliant I²C interface is standard.<br /> <br /> <br /> This story is related to the following:Power Modules |
Hybrid Crystal Resonator comes in miniaturized 2016 package.
2014-01-10 14:30:44| Industrial Newsroom - All News for Today
Supporting 26 and 32 MHz frequencies, ±40 ppm XRCGB-F2P series delivers tolerance levels suited for low-energy Bluetooth™ and Zigbee applications. Liquid proof package, featuring metal cap on ceramic substrate construction, allows for particle screening process while also maintaining shock and drive resistance. Consumer and industrial market applications include wearable products, portable medical devices, smart meters, smart appliances, and wireless sensors. This story is related to the following:Optics and PhotonicsSearch for suppliers of: Crystals
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crystal
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resonator
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