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Kulicke & Soffa Appoints Chan Pin Chong as Vice President, Wedge Bonder Business Unit
2014-02-25 17:35:00| Semiconductors - Topix.net
Mr. Chong will be based at the K&S Office in Santa Ana, California, and report to the Company's President and Chief Executive Officer, Bruno Guilmart.
Tags: business
unit
president
vice
Tresky to Display T-6000 Die Bonder at SEMICON West 2013
2013-06-01 06:00:00| Industrial Newsroom - All News for Today
SWITZERLAND – Tresky, a worldwide leading manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.<br /> <br /> The T-6000 Die Bonder is an all-purpose system for R&D, pilot and medium-size production. Die handling is standard from wafer, ...This story is related to the following:Materials and Material ProcessingWafer Coating Equipment | Conductive Adhesive Bonders | Bonderizing Machinery
Tags: die
west
display
semicon
Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West
2013-01-01 06:00:00| Industrial Newsroom - All News for Today
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA. The semi-automated configuration of the FINEPLACER® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process ...This story is related to the following:Ultrasonic Bonders |