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TI's Multicore Software Development Kit Extended to Low-Power DSP + ARM® Devices

2013-11-12 06:00:00| Industrial Newsroom - All News for Today

MCSDK now available on OMAP-L138 DSP + ARM9&trade; low-cost development kit, reducing development time and enabling scalability to high-performance DSPs<br /> <br /> DALLAS &mdash; Texas Instruments (TI) (NASDAQ: TXN) today announced the availability of its Multicore Software Development Kit (MCSDK) on the low-power OMAP-L138 and OMAP-L132 DSP + ARM9&trade; processors, offering developers reduced development time and scalability to TI's TMS320C6000&trade; high-performance digital signal ...This story is related to the following:SoftwareSearch for suppliers of: Software Development Tools

Tags: software development kit extended

 

Vector Floating-Point DSP supports wireless solutions.

2013-10-24 14:31:05| Industrial Newsroom - All News for Today

Featuring scalable multi-core architecture, 1.3 GHz CEVA-XC4500 DSP supports software-defined wireless infrastructure applications, targeting macrocells, small cells, cloud-RAN, digital front-end, and backhaul. Product incorporates baseband-dedicated ISA, IEEE-compliant floating point support on full vector elements delivering up to 40 GFLOPs performance, fully cached architecture, and hardware managed coherency. For LTE 2 x 2 Pico-Cell baseband processing, device requires as little as 100 mW. This story is related to the following:Digital Signal Processors (DSP)

Tags: solutions wireless supports vector

 
 

DSP Group Chipset Solution Powers iiNET's Innovative Budii(TM) Home Gateway, Home Smartphone, ...

2013-10-22 06:00:00| Industrial Newsroom - All News for Today

DCX DECT SoC and XpandR III Multimedia Chipset Power Australian ISP's NBN-Ready Entertainment and Network Hub, With Home Smartphone, and Tablet<br /> <br /> SAN JOSE, Calif. &ndash; DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that its DCX DECT SoC and XpandR III multimedia chipset are both powering iiNET's Budii&trade; home gateway, home smartphone and tablet.<br /> <br /> iiNET's Budii is a comprehensive ...This story is related to the following:Modem Chips | Chip Sets

Tags: home group solution innovative

 

DSP Group's Chipset Powers Swissvoice Over-the-Top ULE Home Automation Gateway

2013-10-14 06:00:00| Industrial Newsroom - All News for Today

Comprehensive, Highly-Integrated DVF99 Chipset From DSP Group is Ideal for ULE Over-the-Top (OTT) Applications<br /> <br /> SAN JOSE, Calif. &mdash; DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that it was collaborating with Swissvoice, a leading vendor of home communication appliances, to jointly develop an OTT ULE home automation gateway. Leveraging ULE's best-in-class features, the innovative joint ...This story is related to the following:Integrated Circuits (IC) |

Tags: home groups powers gateway

 

DSP Board targets ATCA and MicroTCA systems.

2013-10-11 14:30:41| Industrial Newsroom - All News for Today

With 16 DSP cores and shared memory, Model AMC-2C6678L is suitable as DSP accelerator or front end processor in AdvancedTCA systems used for image sensor processing, voice/video, telecom, and stepper control. Module includes two TMS320C6678 fixed- and floating-point octal core DSPs, which run at 1.25 GHz, for combined performance of 320 GFLOPS and 640 GMACS. Additional features include 4 GB DDR3-1600 SDRAM and 128 MB flash memory, as well as Serial RapidIO, PCIe, and Gigabit Ethernet interfaces. This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Digital Signal Processors (DSP)

Tags: board systems targets dsp

 

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