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Conductive Adhesive suits die attach applications.
2013-10-29 13:29:35| Industrial Newsroom - All News for Today
Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature (Tg) and modulus.<br /> <br /> This story is related to the following:Die Attached Adhesives |
Tags: die
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LED Die Attach Adhesive exhibits high thermal conductivity.
2013-09-12 14:30:08| Industrial Newsroom - All News for Today
Used for attaching LED and other small semiconductor die to silver and copper lead frames, CA-195 has dispense open time of >24 hr (measured as 25% increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing. Electrically conductive solution features glass transition temperature (Tg) that facilitates wire bonding small die, low extractable ionics as well as adhesion to silver and copper lead frames.<br /> This story is related to the following:Die Attached Adhesives | Thermally Conductive Adhesives
Conductive Die Attach Adhesive supports small die and LEDs.
2013-05-08 14:30:59| Industrial Newsroom - All News for Today
Featuring high glass transition temperature to facilitate wire bonding, CA-105 Die Attach Adhesive is suitable for attaching LEDs and other small semiconductor die to silver and copper lead frames. Product has dispensing open time greater than 24 hours, measured as 25% increase in viscosity, while maintaining optimized rheology for pin transfer or needle dispensing. This story is related to the following:Die Attached Adhesives |
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small
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Ergonomic Storage Pouches attach to industrial work vest.
2013-05-07 14:31:09| Industrial Newsroom - All News for Today
Arsenal® 5580 PALS Water Bottle Pouch holds items such as Chill-Its® 5151 Wide Mouth Water Bottle, and has side pocket for powder mix packets and more. Workers can use Arsenal® 5581 PALS Water Bottle Pouch, with 1 L hydration bladder, to stay hydrated, while Arsenal® 5582 PALS Universal Pouch-XL holds tools and gear including breathing equipment. All can be used with MOLLE Vest or standard belt, and have fastening straps for connection to PALS webbing systems. This story is related to the following:Tool Pouches | Hydration Packs | Bottle Carriers
Tags: work
industrial
storage
attach
Ceramic Substrates support SMT soldering and die attach.
2013-04-18 14:29:44| Industrial Newsroom - All News for Today
Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. This story is related to the following:Metallized Ceramics | Substrates
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ceramic