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Culminal (TM) Plus - Launching a New Generation Modified MC - Improving Cementitious Tile Adhesive Designed to Meet Today's Tilling Trends and Challenges

2015-04-28 12:31:13| Industrial Newsroom - All News for Today

Schaffhausen, Switzerland  Ashland Specialty Ingredients, a commercial unit of Ashland Inc. (NYSE: ASH), will launch their new Culminal Plus product line to the European market at the 2015 European Coatings Show, Nuremberg, Germany,  April 21- 23 2015. The demand for Culminal Plus modified methylcellulose (MC...

Tags: to and designed meet

 

UV Cure Adhesive suits circuit assembly applications.

2015-04-27 14:31:07| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

Tags: applications assembly circuit cure

 
 

Ellsworth Adhesives to Display the Latest in Adhesive Technology at SAMPE Expo

2015-04-15 12:31:07| Industrial Newsroom - All News for Today

GERMANTOWN, WI  Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at the Society for the Advancement of Material and Process Engineering, or SAMPE Expo May 19th and 20th at the Baltimore Convention Center in...

Tags: technology latest display expo

 

Report: Hot Melt Adhesive Market in China to Reach RMB 15 Bn in 2019

2015-04-06 07:00:00| Coatings World Breaking News

Tags: in report china market

 

Needle-Bonding Adhesive facilitates cure confirmation, inspection.

2015-03-27 13:31:09| Industrial Newsroom - All News for Today

With viscosity of 150 cP, 1405-M-UR-SC is formulated with Encompass™ technology that incorporates See-Cure color change and Ultra-Red™ fluorescing technologies with LED-curing capabilities. Medical device adhesive is blue in uncured state to aid placement verification and fluoresces bright red under 365 nm black light after cure. Suitable for bonding stainless steel, PC, PMMA, and ABS, adhesive facilitates and accelerates cures at 385 and 405 nm wavelengths.

Tags: inspection confirmation cure facilitates

 

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