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PRESS RELEASE Technology Village Will Be A Highlight of NYC Real Estate Expo Oct. 8

2013-09-26 22:46:00| National Real Estate Investor

Stanley Hurwitz read more

Tags: real technology estate press

 

MTI Electronics to Exhibit November 5-6 at the AmCon Expo in Novi, Michigan

2013-09-26 06:00:00| Industrial Newsroom - All News for Today

MTI Electronics will be exhibiting at the AmCon Design Contract Manufacturing Expo in Novi, MI on November 5th & 6th 2013 at booth # 201.<br /> <br /> AmCon attendees are top level purchasing, engineering and production managers who are directly involved in buying manufacturing products & services and save the time and expense of traveling to prospective suppliers or national trade shows. AmCon regional expos are the cost-effective way to meet with exhibitors.<br /> <br /> This expo features ...

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Dow Introduces Line-Up of Adhesive Technology at PACK EXPO Las Vegas 2013

2013-09-25 07:00:00| Coatings World Breaking News

Tags: las technology pack vegas

 

MDT Showcases TMR Magnetic Sensors at Sensor Expo Japan 2013

2013-09-24 06:00:00| Industrial Newsroom - All News for Today

Advanced TMR Technology Enables High-Performance and Low-Power Magnetic Sensors for Industrial Sensor Applications<br /> <br /> TOKYO and ZHANGJIAGANG, China &mdash; At Sensor Expo Japan 2013( http://www.sensorexpojapan.com/2013/contents_en ), MultiDimension Technology( http://www.multidimensiontech.com ) Co., Ltd. (MDT) will showcase its lineup of advanced Tunneling Magnetoresistance (TMR) magnetic sensors( http://www.dowaytech.com/en/e/action/ListInfo/?classid=5 ), including ultra-low power ...This story is related to the following:Sensors, Monitors and TransducersSearch for suppliers of: Geartooth Sensors | Magnetic Sensors | Position Sensors | Speed Sensors

Tags: japan magnetic sensor expo

 

2013 Student Design Challenge Winners Announced at PACK EXPO

2013-09-24 06:00:00| Industrial Newsroom - All News for Today

Paperboard Packaging Alliance, a joint initiative between AF&PA and the Paperboard Packaging Council, announced winners of its Ninth Annual Student Design Challenge at the PACK EXPO convention. This year's challenge tasked students with designing functional and creative package for movie theater candy, addressing how design could be merchandised. First and second place winners were from Pratt Institute, and third place winners were from Fashion Institute of Technology. This story is related to the following:Trade Associations

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