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Electron Beam Metallization System ensures uniformity.

2013-04-12 14:29:51| Industrial Newsroom - All News for Today

Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping capacity, UEFC-5700 offers production capacity up to forty-two 150 mm wafers in batch. This story is related to the following:Semiconductor Processing Equipment | Electron Beam (EB) Machinery

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SNPs Found for Litter Birthweight, Litter Uniformity

2013-01-14 01:00:00| ThePigSite - Industry News

GLOBAL - TOPIGS has found several Single Nucleotide Polymorphisms (SNPs) which explain genetic variation in litter birthweight and litter uniformity and can be used to breed sows that farrow large, heavy and uniform litters.

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