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Electron Beam Metallization System ensures uniformity.

2013-04-12 14:29:51| Industrial Newsroom - All News for Today

Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping capacity, UEFC-5700 offers production capacity up to forty-two 150 mm wafers in batch. This story is related to the following:Semiconductor Processing Equipment | Electron Beam (EB) Machinery

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