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Intels next-generation Xeon Phi, Knights Landing, now shipping to developers

2016-04-14 13:30:07| Extremetech

Intel's new Xeon Phi, codenamed Knights Landing, is now shipping to developers in two different systems. Will the advent of manycore architectures finally start yielding multi-threading improvements for common users, or is this type of performance intrinsically limited to high-end scientific computing?

Tags: shipping developers landing knights

 

PHI Treatment System ensures food safety.

2016-01-28 14:31:06| Industrial Newsroom - All News for Today

Providing 360° surface application on all exposed surfaces, PHI Food Surface Sanitation Tunnel Treatment System delivers 99.9% surface microbial reduction. Tunnel design has bead blast finish, NEMA enclosures for electrical ballasts, lamp status indicators, optimized heat vent, and lamp and connection design that provides watertight seal. Photohydroionization® process does not affect taste or appearance of product, and tunnel can totally treat product surface without use of chemicals.

Tags: system food safety treatment

 
 

RGF Environmental's PHI Treatment Tests Validate Significant Reduction of Ethylene Gas Levels

2015-06-10 12:31:09| Industrial Newsroom - All News for Today

RIVIERA BEACH, FL While not exactly the Fountain of Youth for fruit and vegetable growers and packing houses, promising news today comes from RGF Environmental Group that its patented PHI-Cell (Photohydroionization) Technology has been tested to significantly reduce ethylene gas levels, providing extended shelf...

Tags: significant levels treatment tests

 

Intels third-generation Xeon Phi to use 10nm technology, deploy second-generation Omni-Path fabric

2014-11-18 21:35:03| Extremetech

Intel has announced its upcoming Knights Hill Many Integrated Core product is coming on 10nm technology. The third-generation Xeon Phi should further expand the capabilities of the family with 50 or more cores and over 16GB of on-card memory.

Tags: technology fabric deploy phi

 

Intels next-gen Xeon Phi will be 3x faster, include next-gen Hybrid Memory Cube tech

2014-06-24 15:35:53| Extremetech

Intel's next-generation Knights Landing is going to pack a huge number of advances, from hyper memory cube technology to a new fabric Interconnect and next-generation 14nm Atom cores.

Tags: include tech memory faster

 

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