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Solder Paste minimizes post-process residue and graping.
2013-05-16 14:30:25| Industrial Newsroom - All News for Today
Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigating head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature. This story is related to the following:Solder Paste
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residue
minimizes
solder
AIM Solder Announces The Release Of NC277 Solder Paste
2013-05-10 08:36:30| surfacefinishing News Articles
AIM Solder announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands
Tags: release
aim
paste
announces
Water-Soluble Solder Paste minimizes voids.
2013-05-03 14:28:05| Industrial Newsroom - All News for Today
Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesFlux Filled Solder | Flux | Solder | Solder Paste Dispensers |
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minimizes
solder
voids
Tin/Bismuth Solder Paste features low-melting formulation.
2013-05-02 14:28:18| Industrial Newsroom - All News for Today
With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesSearch for suppliers of: Solder Paste | Low Melting Alloys
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paste
formulation
solder
FCT Assembly to Present New Technology for Paste Printing at the SMTA Toronto Expo
2013-05-01 06:00:00| Industrial Newsroom - All News for Today
GREELEY, CO -- FCT Assembly announces that it will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions. Keith works closely with the FCT Assembly team, a licensee for Nihon Superior’s SN100C.<br /> <br /> FCT ...
Tags: technology
present
printing
assembly
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