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Non-Conductive Paste promotes flip chip application reliability.
2014-02-06 14:30:13| Industrial Newsroom - All News for Today
Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion. This story is related to the following:Solder Paste
Tags: application
chip
reliability
paste
Stencil for Solder Paste Printing increases yield, reduces waste.
2014-01-29 14:28:58| Industrial Newsroom - All News for Today
Developed to address electronic assembly industry demands, NanoSlic® Gold stencil features coating based on application process that coats both underside of stencil and aperture walls. Thermally cured and permanent coating is hydrophobic and oleophobic, which repels solder paste. Minimizing rework while increasing yields, properties promote solder paste transfer efficiencies for small apertures. Furthermore, properties minimize bridging and reduce underside cleaning. This story is related to the following:Stencils
Tags: increases
printing
waste
yield
Indium Corporation Hires Glen Thomas as Product Manager for Solder Paste
2014-01-29 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.<br /> <br /> Thomas is responsible for managing the company’s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.<br /> <br /> Thomas has over 25 years of experience working with printed wiring ...
Tags: product
manager
corporation
thomas
Essemtec to Introduce World's First SMT Assembler with Integrated Solder Paste Jet Printer at ...
2014-01-28 06:00:00| Industrial Newsroom - All News for Today
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will debut its new SMT production centre in booth #851 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.<br /> <br /> Two in One<br /> Jetting of solder paste instead of ...This story is related to the following:Printing and Duplicating EquipmentSearch for suppliers of: Surface Mount Assembly Equipment | Surface Mount Technology (SMT) Screen Printers |
Tags: printer
integrated
introduce
jet
Pb-Free Solder Paste delivers high first pass yields.
2013-12-16 14:30:45| Industrial Newsroom - All News for Today
Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. This story is related to the following:Solder Paste
Tags: high
pass
delivers
paste
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