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PVD Systems support processes for MEMS, sensors, and IoT.
2015-07-20 14:31:07| Industrial Newsroom - All News for Today
MRC® Eclipse™ Star, Mark II, and Mark IV physical vapor deposition (PVD) systems, which cover 100–200 mm wafer size capability for front or backside metallization, support integrated PVD process solutions for MEMS, sensors, and Internet of Things (IoT) applications. Processes include deposition of ceramic materials for gas and chemical sensors, aluminum oxide deposition for surface passivation of reflective materials, and deposition of complex metal film stacks for liftoff applications.
Tags: support
systems
processes
sensors
Alcoa doubling high-tech coating capacity in Michigan for aerospace; new electron beam PVD machine
2014-12-12 13:55:36| Green Car Congress
Tags: machine
capacity
michigan
electron
PVD System aids 300 mm power device manufacturing.
2013-09-09 14:30:33| Industrial Newsroom - All News for Today
With options that include modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers, Sigma fxP addresses challenges faced while scaling power physical vapor deposition (PVD) processes up to 300 mm wafer size. System deposits thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. It also carries thin wafer handling hardware and uses film deposition stress control to maximize throughput with minimal wafer bow. This story is related to the following:Physical Vapor Deposition (PVD) Systems
Tags: system
power
device
manufacturing
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