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HDMI to DSI MIPI Converter Chipset drives Next-Gen SFF LCDs.

2013-10-04 14:29:38| Industrial Newsroom - All News for Today

With LSI video processing, de-interlacing, and scaling, TC358779XBG enables HDMI video output to be converted and processed as MIPI® Display Serial Interface (DSI) video stream for small form-factor (SFF) LCDs. This 80-pin device, measuring 7.0 x 7.0 mm with 0.65 mm ball pitch and 1.0 mm max height, supports 3D video formats and protocols compatible with HDMI 1.4 standard. Max resolution supported is 1,920 x 1,200 @ 24 bpp at refresh rate of 60 fps. This story is related to the following:Computer Hardware and PeripheralsTest and Measuring InstrumentsSearch for suppliers of: Media Converters | Image Converters |

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ALi first chipset partner to launch Conax Cardless Reference Design

2013-09-16 20:00:09| Digital TV News

ALi Corporation has announced that its family of STB chipsets will be the first to support the new Conax Cardless solution for STBs. To enable rapid development, Conax and ALi offer a reference design with the Conax Cardless security core embedded.

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ALi, First Chipset Partner with Conax to Launch Conax Cardless Reference Design

2013-09-16 06:00:00| Industrial Newsroom - All News for Today

Amsterdam and Taipei &ndash; ALi Corporation, a leading Set-Top Box (STB) solution provider, today announced that ALi's family of STB chipsets will be the first chipsets to support the new Conax Cardless solution for STBs. To enable rapid development of Cardless STBs, Conax and ALi offer a reference design where the security core of Conax Cardless is embedded. The comprehensive ALi reference design will provide fast-time-to-market and offer easy implementation to various STB vendors.<br /> <br ...This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Search for suppliers of: Data Security Software | Chip Sets

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Chipset Updates: QUALCOMM, Inc. (QCOM)'s Patent, Intel Corporation...

2013-09-14 10:44:13| Semiconductors - Topix.net

Qualcomm Assigned Patent for Distributed Building Blocks of R-C Clamping Circuitry in Semiconductor Die Core Area QUALCOMM, Inc. , San Diego, has been assigned a patent developed by four co-inventors for a "distributed building blocks of R-C clamping circuitry in semiconductor die core area."

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Sigma Designs to launch ARM-based chipset at IBCShow

2013-09-12 13:30:18| Digital TV News

Sigma Designs (Nasdaq: SIGM) is to launch its new chipset SMP8734 at IBC 2013. Combining a high performance ARM A9 CPU with an Imagination SGX GPU, the SMP8734 will enable a new level of user experience with minimal extra cost.

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