Based on XMplus 3D camera module with more than 120 megapixels, S3088 ultra gold features image field size of 50 x 50 mm and inspection speeds up to 65 cm²/s. System works with integrated structured light projector. Fields of view from up to 9 perspectives enable exact 3D analyses, with which lifted leads, chip coplanarity, and other critical defects are detected. Measuring 40 x 60 in., system includes touchscreen operation, vVision and EasyPro inspection software, and high-speed PCB transport.