Featuring seamless software integration with GEMINI® FB fusion wafer bonding system, EVG®40NT supports manufacture of 3D-integrated CMOS image sensors. Automated system performs non-destructive, top-to-bottom side alignment accuracy measurements on double-sided structured wafers or bond interfaces as well as critical dimension and box-in-box measurements of single- and double-sided structured wafers. Wafer-to-wafer alignment accuracy is measured to within 40 nm (3 sigma).
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