On May 20-21 and May 23, 2013, IPC ESTC will feature 8 educational courses examining packaging, materials, design, and assembly considerations in electronics, from bare board to end-product. Courses will take systems approach to sustainable and cradle-to-grave product lifecycles. Examples include: Advanced Packaging; Soldering Technology for Electronics Assembly: Achieving High Yields and Reliability; Simulation Based Reliability Assessment; and PCB Fabrication Basics.
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