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Home › Enhanced Interconnect Medium Simplifies Test & Verification

 

Enhanced Interconnect Medium Simplifies Test & Verification

2013-11-14 15:39:34| wirelessdesignonline News Articles

In high performance embedded systems test application, the requirement for accurate measurement of AC and DC parameter is often critical. During development phase, IC devices are not permanently attached to the target board. Instead IC devices are connected via interconnect medium to the target board. By Ila Pal, Ironwood Electronics, Inc.

Tags: test medium enhanced verification

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