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Hybrid Memory Cube spec makes DRAM 15 times faster

2013-04-02 15:20:10| InfoWorld: Top News

Backed by 100 tech companies, the three largest memory makers announced the final specifications for three-dimensional DRAM, which is aimed at increasing performance for networking and high-performance computing markets. Micron, Samsung and Hynix are leading the technology development efforts backed by the Hybrid Memory Cube Consortium (HMC). The technology, called a Hybrid Memory Cube, will stack multiple volatile memory dies on top of a DRAM controller.

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