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Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM

2014-04-23 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.<br /> <br /> Heat-Spring® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under ...This story is related to the following:Thermal Interface Materials

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