Home › Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging
 

Keywords :   


Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging

2014-04-29 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature SACm&trade; solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.<br /> <br /> SACm&trade; is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm&trade; is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, ...This story is related to the following:Solder Paste

Tags: features corporation packaging paste

Category:Industrial Goods and Services

Latest from this category

All news
15.09Your MANA RepFinder Profile
Industrial Goods and Services »
28.09Weekly Recap: AkzoNobel, BASF, Axalta, PPG Top This Weeks Stories
28.09Post-Tropical Cyclone Helene Public Advisory Number 20
28.09Hurricane Isaac Graphics
28.09Hurricane Isaac Forecast Discussion Number 10
28.09Hurricane Isaac Wind Speed Probabilities Number 10
28.09Hurricane Isaac Public Advisory Number 10
28.09Summary for Hurricane Isaac (AT5/AL102024)
28.09Hurricane Isaac Forecast Advisory Number 10
More »