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Indium Corporation Releases BiAgX Solder Paste Technology as Drop-In Replacement for High-Pb Solders

2015-04-06 12:31:12| Industrial Newsroom - All News for Today

Environmental and legislative concerns are driving consumers away from products using solders that contain lead (Pb), including solders used in die-attach applications for analog semiconductor assembly. Indium Corporation's BiAgX solder paste technology is a high-melting, lead-free (Pb-free) solder paste technology...

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