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Industrial Picosecond Lasers enable machining of thick materials.

2013-09-10 14:31:32| Industrial Newsroom - All News for Today

Talisker HE series offer output options – 200 µJ pulse energy in NIR (1,064 nm), 120 µJ per pulse in green (532 nm), 40 µJ pulse energy in UV (355 nm) – that enable drilling, cutting, and scribing of thick materials. Lasers are optimized for pointing stability and use Cold Ablation, which promotes process quality with minimal heat affected zone and no unwanted melt debris. As pulse energy extends optical depth of focused beam, cold ablation occurs throughout full thickness of material. This story is related to the following:Ultrashort Pulse Lasers |

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