Home › Kulicke & Soffa Joins High-Density Fan-Out Wafer Level Packaging Consortium
 

Keywords :   


Kulicke & Soffa Joins High-Density Fan-Out Wafer Level Packaging Consortium

2015-04-18 13:21:54| Semiconductors - Topix.net

Through the collaboration, K&S is confident that with the combined experience and knowledge, the consortium will extend FOWLP capabilities for applications, such as tablets and smart phones, and provide solutions to overcome current FOWLP limitations. FOWLP enables multiple chips to be integrated in small form factor on a single package.

Tags: level packaging joins consortium

Category:Electronics and Electrical

Latest from this category

All news
»
02.11Tropical Depression Thirteen-E Graphics
02.11Summary for Tropical Depression Thirteen-E (EP3/EP132024)
02.11Fragrancing Spaces with Atmos, A Smart Home Diffuser
02.11Eastern North Pacific Tropical Weather Outlook
02.11Atlantic Tropical Weather Outlook
01.11Tropical Depression Thirteen-E Forecast Discussion Number 1
01.11Tropical Depression Thirteen-E Graphics
01.11Tropical Depression Thirteen-E Wind Speed Probabilities Number 1
More »