Designed for compound semiconductor manufacturing, Critical Etch Systems for Au, Ag, Cu and TiW deliver optimized within-wafer, wafer-to-wafer, and batch-to-batch etch uniformity. Wet processing systems also enable consistent etching even within dense patterned areas. Field proven on 1–5 µm features, batch immersion systems are configurable for single or combination metal etch steps over wide variety of needs.
This story is related to the following:Wet Etch Equipment |