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Microsemi Expands Customer Application Design Opportunities By Introducing SmartFusion2 Advanced Development Kit With Largest Density 150K LE Device
2014-09-30 13:13:07| wirelessdesignonline News Articles
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company's new largest density, lowest power SmartFusion®2 150K LE System-on-Chip (SoC) FPGA Advanced Development Kit.
Tags: advanced
design
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Category:Telecommunications
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